All of Goldkey's products are fully RoHS-compliant, and have a RoHS-compliant label marked on their packaging. To date, Goldkey's growing list of green components includes lead-free DRAM, Flash, electric resistors and capacitors, controllers, EEPROM, etc., as well as lead-free & halogen-free PCBs and lead-free solder pastes, solder bars and solder wires. Goldkey adopts the use of green packaging and lead-free standardized manufacturing processes with the goal to comply with the Restriction on Hazardous Substance (RoHS) per the EU Directive and other government regulatory requirements.
|Substance||Threshold||Status of Goldkey's Products|
|Lead||1000ppm of homogeneous material||Most below threshold, some exceed limit are applied to exemption of RoHS Directive.|
|Cadmium||1000ppm of homogeneous material||Below threshold, rare impurity in metal material.|
|Mercury||1000ppm of homogeneous material||Not used|
|Hexavalent Chromium||1000ppm of homogeneous material||Not used|
|Polybrominated biphenyls (PBB)||1000ppm of homogeneous material||Not used|
|Polybrominated diphenyl ethers (PBDE)||1000ppm of homogeneous material||Not used|
|Bis(2-Ethylhexyl) phthalate (DEHP)||1000ppm of homogeneous material||Not used|
|Benzyl butyl phthalate (BBP)||1000ppm of homogeneous material||Not used|
|Dibutyl phthalate (DBP)||1000ppm of homogeneous material||Not used|
|Diisobutyl phthalate (DIBP)||1000ppm of homogeneous material||Not used|
Dedicated to minimizing the impact on our environment, Goldkeycomplies with the WEEE Directive, reducing waste arising from electrical and electronic equipment.
The crossed-out wheel bin symbol attached to a productmeans the product is covered by the European Directive 2002/96/EC, and is not allowed to be disposed of with other household waste. Please consult local authorities on the separate collection of electrical and electronic products as correct disposal helps prevent potential negative consequences on the environment and society.
Goldkey does not use PFOS in any of its manufacturing processes. A limited number of wafer fabrication operations of Goldkey's die component suppliers use PFOS in some critical applications in the photoresist coatings of their photolithography process of wafer manufacturing. However, such uses are within the exemptions provided for photolithography processing in accordance to EU Directive 2006/122/EC of restricting the use of PFOS.
Goldkeymaintains two lists of hazardous substances: one for products and one for packaging materials. Packaging materials comply with Directive 94/62/EC on Packaging and Packaging Waste. A recycle-icon is printed on our packaging materials, denoting these can be recycled by a recycling scheme, Green Punkt, in Europe.
To date, Goldkey's growing list of green components includes lead-free DRAM, Flash, electric resistors and capacitors, controllers, EEPROM, ICs, etcetera, as well as lead-free & halogen-free PCBs and lead-free solder pastes, solder bars and solder wires.
Goldkey adopts the use of green packaging and lead-free standardized manufacturing processes with the goal to comply with the Restriction on Hazardous Substance (RoHS) per the EU Directive and other government regulatory requirements.
Since REACH guidelines are perpetually evolving, Goldkey continues to evaluating the REACH Directive and associated guidance to better disseminate the information throughout the supply chain.
Goldkey's compliance efforts include an evaluation process for our products. The process involves analysis, third party testing, and information provided by the manufacturers/distributors of raw materials or by subcontract assemblers of Goldkey's electronic products.
Conforming with Article 33 of the REACH Regulation, all substances used in Goldkey’s products do not contain, or contain in a concentration below 0.1% w/w Substances of Very High Concern (SVHC) on the Candidate List, except for the substances listed below.
|1,2-dimethoxyethane;ethylene glycol dimethyl ether (EGDME)||110-71-4|
|Lead monoxide (lead oxide)||1317-36-8|
|Lead titanium trioxide||12060-00-3|
Goldkey developed several technologies and processes aimed at reducing environmental impacts caused by, and during, products life cycle. The following chart constitutes the greatest impact factors under which Goldkey could autonomously implement on its own.
|Product Life Cycle Stage||Low Profile PCB||Energy-saving DRAM Modules||Hazardous-Substance-Free (HSF)||Reduction of packaging material|
|End of life||✓|
Goldkey is committed to not using raw materials from conflict regions controlled by non-governmental military groups, or unlawful military factions. Goldkey takes due diligence within its own supply chain to assure "DRC Conflict-Free" and that the metals of gold (Au), tantalum (Ta), tungsten (W), cobalt (Co) and tin (Sn) are not derived from or sourced from mines in conflict areas of the Democratic Republic of Congo (DRC), or acquired through illegal transactions. Countries that do not meet the requirements of "Conflict-Free" include the following: DRC, Uganda, Burundi, Tanzania and Kenya (the United Nations Security Council lists metals from these countries are of DRC origins).
As a global citizen, Goldkey declares and commits to refusing the application of metals from conflict regions; whilst requesting suppliers of Goldkey's supply chain to comply with the following requirements: